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Application

　　Industry Overview

　　IC packaging refers to the process of connecting the circuit pins on a silicon wafer to external leads via bonding wires, enabling connection with other components. A package type denotes the housing used to mount a semiconductor integrated circuit chip. It serves not only to mount, secure, seal, and protect the chip while enhancing its thermal‑electrical performance, but also to route electrical connections from the chip’s pads to the package’s lead frames; these leads are then interconnected with other devices through conductive traces on a printed circuit board, thereby establishing connectivity between the internal chip and the external circuitry. Moreover, the chip must be isolated from the external environment to prevent atmospheric contaminants from corroding its circuitry and degrading its electrical characteristics.

　　Adhesive solution

　　IC packaging conductive adhesive is suitable for the encapsulation and bonding of a wide range of electronic components and assemblies, including LEDs, high-power LEDs, LED digital displays, LCDs, transistors, ICs, COB modules, PCBA boards, FPCs, FC packages, EL cold‑light panels, display screens, piezoelectric crystals, crystal oscillators, resonators, solar cells, photovoltaic cells, buzzers, and discrete semiconductor devices. Its applications span the fields of electronic components, circuit board assembly, the display and lighting industries, telecommunications, automotive electronics, smart cards, radio‑frequency identification, and electronic tags.

　　Product Selection:

Product model
Product

Conductive medium
Conductive medium

Solvent
Solvent

Thixotropy index
Thixotropic
index

Specific gravity

Proportion

Recommended curing conditions
Recommended
curing conditions

Optional curing conditions
Optional curing
conditions

Characteristics
Character

Waen®EN100

Silver powder