Radio-frequency tags generally refer to radio-frequency identification technology. The underlying principle is non-contact data communication between a reader and a tag, enabling the identification of objects. RFID has a wide range of applications, including animal microchips, automotive anti-theft systems, access control, parking lot management, production-line automation, and material management.
IC packaging refers to the process of connecting the circuit pins on a silicon wafer to external leads via bonding wires, enabling connection with other components. A package type denotes the housing used to mount a semiconductor integrated circuit chip. It serves not only to mount, secure, seal, and protect the chip while enhancing its thermal‑electrical performance, but also to route electrical connections from the chip’s pads to the package’s lead terminals. These leads are then interconnected with other devices through conductive traces on a printed circuit board, thereby establishing the link between the internal chip and the external circuitry. Moreover, the chip must be isolated from the external environment to prevent atmospheric contaminants from corroding its circuitry and degrading its electrical characteristics.
A crystal oscillator exhibits the piezoelectric effect: when a voltage is applied across its electrodes, the crystal deforms; conversely, if an external force causes the crystal to deform, a voltage is generated between the electrodes. Crystal oscillators are commonly connected to circuits such as the motherboard, southbridge, and sound card. They can be likened to the “heartbeat” generators of various circuit boards; if the main board’s “heartbeat” malfunctions, it will inevitably cause failures in other circuits as well.
Single-component epoxy structural adhesive
It is widely used for bonding and securing electronic components, crafts, and gifts, and exhibits excellent adhesive strength when encapsulating and bonding metals, piezoelectric ceramics, wood, glass, and rigid plastics.
It is applicable to other thermosetting adhesives, such as those used in quartz crystal resonators, pyroelectric infrared sensors, tantalum capacitors, LCMs, and IC packages.
Two-component epoxy structural adhesive
This product is a fast-curing, viscous epoxy adhesive.
Single-component silicone adhesive
This product is widely used for coating and protecting the leads of electronic components such as ICs, capacitors, and transistors on PCBA boards, as well as for waterproofing, moisture resistance, and bonding in products like sensors, guardrail tubes and luminaires, electrical equipment, and optical instruments.
This product is widely used for encapsulation and protection of electronic components such as transformers, capacitors, power modules, motor controllers, automotive power supplies, battery packs, relays, sensors, and other related products.
Two-component transparent epoxy adhesive
It can be used for transparent potting, such as in optical electrical components and instruments.
Two-component silicone potting compound
It is primarily used for the encapsulation and sealing of communication cables and precision components.
Two-component polyurethane potting compound
This product is widely used for potting and encapsulation protection in automotive electronic components, sensors, and electrical appliances; as well as for insulating potting of electrical devices, capacitors, power supplies, and more.
Focusing on the innovation and application of adhesives in the electronic market
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